Flexible And Lightweight PI Heating Film For Energy Efficient Applications

This flame-retardant PI epoxy heat press adhesive film is a high-performance bonding material with excellent adhesion, high-temperature resistance, and chemical resistance, ideal for automotive and flexible circuit applications.

1. Heater circuit stone engraving
2. Flexible printed circuit (FPC) manufacturing
3. New energy power battery temperature control collection lines
4. Bonding and lamination of hot-pressed copper
5. Bonding and lamination of stainless steel materials
6. Automotive electronic component assembly

1. Q: What materials can this adhesive film bond to?
2. A: It is primarily used for bonding hot-pressed copper and stainless steel.
3. Q: What industries is this product suitable for?
4. A: It is ideal for the new energy automotive industry, especially for battery and FPC applications.
5. Q: What are the key advantages of this adhesive?
6. A: It offers excellent bonding strength, high-temperature resistance, anti-cracking properties, and chemical resistance.
7. Q: Can it withstand harsh chemical environments?
8. A: Yes, it shows no reaction after 25 hours of immersion in acids (HCl 0.1N, H₂SO₄ 95%) and bases (NaOH 10%).
9. Q: What colors are available for this product?
10. A: It is available in black and tea color.
11. Q: What is the processing capability after hot pressing?
12. A: After hot pressing, it can undergo various sheet metal processes.